EPIBOND® 115 A/B is an extrudable, two-component, heat curing epoxy structural adhesive designed for service temperatures up to 300°F (149°C). This product is suitable for bonding a wide variety of materials such as metals, composites, and many other similar substrates. The combination of high strength and high Tg performance makes this adhesive well suited for aerospace and other demanding applications. EPIBOND® 115 A/B contains 5 mil (125 micron) spacer beads to help provide a uniform bond line required in high stress areas.
Typical Properties
Appearance |
N/A Off-white |
Density |
N/A 1.12 g/cm³ |
Viscosity at 77 Degree Fahrenheit (ºF) (25 Degree Celsius (ºC)) Temperature |
N/A Thixotropic Paste cP |
Original Equipment Manufacturer (OEM) Specifications |
N/A Huntsman standard certification |
Mixed Viscosity at 77 Fahrenheit (ºF) Temperature |
N/A 280,000 cP |
Minimum Gel Time/Pot Life at 77 Fahrenheit (ºF) Temperature |
N/A 135-145 (150 gram mass) minutes |
Suggested Cure Schedule Fahrenheit (ºF) |
N/A 1 hour at 150 ºF + 3-5 hours at 200 ºF |
Maximum Service Temperature |
N/A 300 ºF |
Lap Shear Strength at 77 Fahrenheit (ºF) Temperature (Aluminum to Aluminum) |
N/A 4740 psi |
Lap Shear Strength at 180 Fahrenheit (ºF) Temperature (Aluminum to Aluminum) |
N/A 4,000 psi |
Flame Retardant |
N/A FALSE |
Packaging |
N/A 50-ml, 200-ml 2:1 dual cartridges |
Color |
N/A Off-White |
Compressive Strength at 77 Fahrenheit (ºF) |
N/A 13000 psi |
First Aid |
N/A
Refer to SDS as mentioned above. |
Appearance - EPIBOND® 115 A Resin |
N/A Off-white |
Appearance - EPIBOND® 115 B Hardener |
N/A Amber |
Appearance - Mixed Adhesive |
N/A Off-white |
Appearance - Test Method |
N/A Visual |
Density - EPIBOND® 115 A Resin |
N/A 1.13 g/cm³ |
Density - EPIBOND® 115 B Hardener |
N/A 1 g/cm³ |
Density - Mixed Adhesive |
N/A 1.12 g/cm³ |
Density - Test Method |
N/A ASTM D1875 |
Viscosity at 77°F (25°C) - EPIBOND® 115 A Resin |
N/A Semi-Paste cP |
Viscosity at 77°F (25°C) - EPIBOND® 115 B Hardener |
N/A Paste cP |
Viscosity at 77°F (25°C) - Mixed Adhesive |
N/A Thixotropic Paste cP |
Viscosity - Test Method |
N/A ASTM D2196 |
Pretreatment |
N/A Substrates to be bonded should be properly surface treated and be free from contaminants. |
Working time |
N/A approximately 120 - 180 minutes |
Gel time, 100 g, @ 77°F, > |
N/A 180 |
Typical Cure Cycle |
N/A 1 h at 150-158 °F + 3 - 5 h at 200-275°F or 1 h at 210-220 °F +1 h at 250-260 °F |
Tensile lap shear strength at 77°F (25°C) |
N/A 4740 psi |
Tensile lap shear strength at 200°F (93°C) |
N/A 3975 psi |
Tensile lap shear strength at 350°F (177°C) |
N/A 924 psi |
Tensile lap shear strength at -85°F (-65°C) |
N/A 4520 psi |
Tensile lap shear strength - Test Method |
N/A ASTM D1002 |
T-Peel strength |
N/A 10 (1.75) pli (N/mm) |
T-Peel strength - Test Method |
N/A ASTM D1867 |
Tg by DMA Dry Tg as cured |
N/A 295 (128) °F (°C) |
Wet Tg after 42-day at 145°F at 85% RH |
N/A 253 (123) °F (°C) |
Tg - Test Method |
N/A ASTM D-7028 |
Tensile Strength at 77°F (25°C) |
N/A 5000 psi |
Tensile Strength - Test Method |
N/A ASTM D-638 |
Flexural Strength at 77°F (25°C) |
N/A 11000 psi |
Flexural Strength - Test Method |
N/A ASTM D-790 |
Compressive Strength at 77°F (25°C) |
N/A 13000 psi |
Compressive Strength - Test Method |
N/A ASTM D-695 |
Handling strength - 16 hours at RT |
N/A 730 psi |
Handling strength - 1 hour at 155°F |
N/A 3725 psi |
Handling strength - 1 hour at 155°F + 5 hours at 200°F |
N/A 4740 psi |
Bondline Thickness Control - 0.010 inches |
N/A 4740 psi |
Bondline Thickness Control - 0.020 inches |
N/A 4000 psi |
Bondline Thickness Control - 0.040 inches |
N/A 3000 psi |
Bondline Thickness Control - 0.080 inches |
N/A 2000 psi |
Mixing
|
N/A
Mix both components thoroughly for several minutes until a homogeneous mixture is obtained or dispense from a 400 mL. For 400 mL cartridges, use a Static mixer 10.13mm diameter x 18 element spiral mixing nozzle (INFINITY MIX MCH-10-18T) or equivalent. |
Mix Ratio
Mix Ratio |
N/A EPIBOND® 115 A Resin - Parts by weight: 100; EPIBOND® 115 A Resin - Parts by volume: 2; EPIBOND® 115 B Hardener - Parts by weight: 44; EPIBOND® 115 B Hardener - Parts by volume: 1 |
Mix Ratio Ritt by Weight |
N/A 100:44:00 |
Mix Ratio - EPIBOND® 115 A Resin - Parts by weight |
N/A 100 |
Mix Ratio - EPIBOND® 115 A Resin - Parts by volume |
N/A 2 |
Mix Ratio - EPIBOND® 115 B Hardener - Parts by weight |
N/A 44 |
Mix Ratio - EPIBOND® 115 B Hardener - Parts by volume |
N/A 1 |
Processing Data
Typical Cure Cycles |
N/A 1 h at 150-158 °F + 3 - 5 h at 200-275°F or 1 h at 210-220 °F +1 h at 250-260 °F |
Typical Physical Properties
Tensile Strength |
N/A 5000 psi |
Test Method for Tensile Strength |
N/A ASTM D-638 |
| T-Peel Strength1 | N/A 22 lb/in |
Applications
Applications |
N/A
The mixed adhesive should be spread with a spatula to the suitably pretreated dry joint surfaces. A layer of adhesive 0.004 to 0.012 inches (0.1 to 0.3 mm) thick will normally provide the maximum lap shear strength. This adhesive, however, has been designed to be effective in layers up to 0.12 in. (3 mm). Components to be bonded should be assembled and clamped as soon as the adhesive has been applied. Even contact pressure throughout the joint area during cure will ensure optimum performance. |
Features
|
N/A
|
Storage
|
N/A EPIBOND® 115 A/B should be stored in a dry place in its original sealed container at a temperature between 2°C and 40°C (36°F and 104°F). Tightly reseal containers after each use. Under these storage conditions, the product has a shelf-life of 12 months (from date of manufacture). The components should not be exposed to direct sunlight. |
Precautionary Statement
|
N/A
Huntsman Advanced Materials Americas LLC maintains up-to-date Safety Data Sheets (SDS) on all its products. These sheets contain pertinent information that you may need to protect your employees and customers against any known health or safety hazards associated with our products. Users should review the latest MSDS to determine possible health hazards and appropriate precautions to implement prior to using this material. |
- 1 Anodized and Primed Aluminum, 77 ºF (25 ºC), 15-mil (0.375 mm) Bond Thickness